HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
PRODUCT DESCRIPTION
Hysol® FP4450 is high purity, low stress liquid encapsulantwith good moisture resistance and an extended working life. Itis designed for protection of bare semiconductor devices.Pressure pot performance on live devices is up to 500 hourswith no failures, depending upon device and package type.
This material is designed for temperature cycling ranges up to
-65°C to 150°C. Pot life or working life has been extended to
approximately 3 days. This liquid epoxy exhibits relatively high
flow. A cavity or a potting dam is required for flow control.
Hysol® FP4450 may be suitable for bare chip protection in a
variety of advanced packages such as IC memory cards, chip
carriers, hybrid circuits, chip-on-board, multi-chip modules, ball
grid arrays and pin grid arrays. The high temperature
performance and excellent resistance to chemicals, moisture
and handling damage, are also advantageous for automotive
applications.
Extractable Ionic Content (ITM107B)
Chloride (Cl-), ppm 5
Sodium (Na+), ppm 1
Potassium (K+), ppm 2
Handling
Pot Life @ 25°C, 77°F, days, 3
(200 gram mass ),(ITM10T),
Gel Time @ 121°C, (250°F), minutes 12
產(chǎn)品描述
Hysol®FP4450是高純度，低應(yīng)力液體密封劑
具有良好的耐濕性和延長(zhǎng)的使用壽命。它
被設(shè)計(jì)用于保護(hù)裸半導(dǎo)體器件。
現(xiàn)場(chǎng)設(shè)備的壓力罐性能可達(dá)500小時(shí)
沒有故障，取決于設(shè)備和包裝類型。
該材料專為溫度循環(huán)范圍而設(shè)計(jì)
-65℃至150℃。使用壽命或工作壽命延長(zhǎng)至
約3天。該液體環(huán)氧樹脂顯示較高
流。流量控制需要一個(gè)空腔或灌封壩。
Hysol®FP4450可能適用 |
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