ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17
ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17
ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17
ECCOBOND 2332-17 is a solventless epoxy adhesive that
develops high bond strength when cured at temperatures as
low as 100 to 130°C. It combines flexibility at low temperatures
plus high peel and tensile shear strength over a broad
temperature range.
本公司專業(yè)提供電子膠黏劑、樂泰 樂泰膠等產(chǎn)品服務(wù)和相關(guān)技術(shù)咨詢，歡迎廣大新老朋友就電子膠黏劑、樂泰 樂泰膠等方面的問題與我們溝通交流。
技術(shù)服務(wù)熱線：021-51693135 |
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