樂泰 3508電子組裝/樂泰 3508電子組裝/樂泰 3508電子組裝/樂泰 3508電子組裝/樂泰 3508電子組裝/樂泰 3508電子組裝/樂泰 3508電子組裝/樂泰 3508電子組裝/樂泰 3508電子組裝/樂泰 3508電子組裝/樂泰 3508電子組裝/樂泰 3508電子組裝/樂泰 3508電子組裝/樂泰 3508電子組裝/樂泰 3508電子組裝/樂泰 3508電子組裝/樂泰 3508電子組裝/樂泰 3508電子組裝/樂泰 3508電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
3508™ reworkable cornerfill is designed to cure during pb-free
reflow while allowing self-alignment of IC components. It can
be pre-applied to the board at the corners of the pad site
using a standard SMA dispenser.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Cone & Plate, @ 25 °C mPa∙s (cP) 50,000
Specific Gravity @ 25 °C 1.24
Pot Life @ 25oC, days >30
Shelf Life @ 2 to 8°C, months 6
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Recommended Cure Schedule
Pb-free solder reflow profile @ 245°C
(3 hours @ 180°C for Tg testing)
The above cure profile is a guideline recommendation. Cure
conditions (time and temperature) may vary based on
customers' experience and their application requirements, as
well as customer curing equipment, oven loading and actual
oven temperatures.
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 2 to 8°C. Storage below 2°C or greater
than 8°C can adversely affect product properties. 3508™可重復(fù)使用的拐角填充物設(shè)計(jì)用于在無pb時(shí)固化
回流，同時(shí)允許IC組件的自對(duì)準(zhǔn)。它可以
預(yù)先施加到墊子位置角落的板上
使用標(biāo)準(zhǔn)SMA分配器。
固化材料的典型特性
粘度，錐和板，@ 25°C mPa∙s（cP）50,000
比重@ 25°C 1.24
25°C，天> 30
保質(zhì)期2至8°C，月6
閃點(diǎn) - 參見MSDS
典型的固化性能
推薦治療時(shí)間表
無鉛焊料回流焊@ 245°C
（對(duì)于Tg測(cè)試，180℃下3小時(shí)）
以上治療方案是指導(dǎo)性建議。治愈
條件（時(shí)間和溫度）可能會(huì)有所不同
客戶的經(jīng)驗(yàn)和應(yīng)用要求
以及客戶固化設(shè)備，烤 |
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