ECCOBOND C850-6電子組裝/ECCOBOND C850-6電子組裝/ECCOBOND C850-6電子組裝/ECCOBOND C850-6電子組裝/ECCOBOND C850-6電子組裝/ECCOBOND C850-6電子組裝/ECCOBOND C850-6電子組裝/ECCOBOND C850-6電子組裝/ECCOBOND C850-6電子組裝/ECCOBOND C850-6電子組裝/ECCOBOND C850-6電子組裝/ECCOBOND C850-6電子組裝/ECCOBOND C850-6電子組裝/ECCOBOND C850-6電子組裝/ECCOBOND C850-6電子組裝/ECCOBOND C850-6電子組裝/ECCOBOND C850-6電子組裝/ECCOBOND C850-6電子組裝/ECCOBOND C850-6電子組裝/ECCOBOND C850-6電子組裝/ECCOBOND C850-6電子組裝/ECCOBOND C850-6電子組裝/ECCOBOND C850-6電子組裝/ECCOBOND C850-6電子組裝/ECCOBOND C850-6電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
ECCOBOND C850-6 die attach epoxy adhesive was designedfor bonding most plastic packaged ICs and other die attachapplications.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield , mPa•s (cP):
Speed 5 rpm, #TC 100,000
Density, g/cm3 3.2
Shelf Life @ 0°C, months 6
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
1 hour @ 125°C or
30 minutes @ 150°C or
1 minute @ 250°C
Post Cure
1 to 2 hours at the highest expected use temperature
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based oncustomers' experience and their application requirements, aswell as customer curing equipment, oven loading and actualoven temperatures. Storage
Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage: 0 °C
ECCOBOND C850-6貼片環(huán)氧膠粘劑設(shè)計(jì)用于粘合大多數(shù)塑料封裝IC和其他裸片附著
應(yīng)用程序。
固化材料的典型特性
粘度，布魯克菲爾德，mPa•s（cP）：
速度5 rpm，#TC 100,000
密度，g / cm 3 3.2
保質(zhì)期0°C，月6
閃點(diǎn) - 參見MSDS
典型的固化性能
治愈時(shí)間表
125℃下1小時(shí)或
在150°C或30分鐘
250°C 1分鐘
后治
在*高預(yù)期使用溫度下1至2小時(shí)以上治療方案是指導(dǎo)性建議。治愈條件（時(shí)間和溫度）可能會(huì)有所不同
客戶的經(jīng)驗(yàn)和應(yīng)用要求以及客戶固化設(shè)備，烤箱裝載和實(shí)際烘箱溫度。存儲(chǔ)將產(chǎn)品存放在未開封的容器中，干燥處。存儲(chǔ)信息可能會(huì) |
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