HYSOL QMI 529HT電子組裝/HYSOL QMI 529HT電子組裝/HYSOL QMI 529HT電子組裝/HYSOL QMI 529HT電子組裝/HYSOL QMI 529HT電子組裝/HYSOL QMI 529HT電子組裝/HYSOL QMI 529HT電子組裝/HYSOL QMI 529HT電子組裝/HYSOL QMI 529HT電子組裝/HYSOL QMI 529HT電子組裝/HYSOL QMI 529HT電子組裝/HYSOL QMI 529HT電子組裝/HYSOL QMI 529HT電子組裝/HYSOL QMI 529HT電子組裝/HYSOL QMI 529HT電子組裝/HYSOL QMI 529HT電子組裝/HYSOL QMI 529HT電子組裝/HYSOL QMI 529HT電子組裝/HYSOL QMI 529HT電子組裝/HYSOL QMI 529HT電子組裝/HYSOL QMI 529HT電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
QMI 529HT is a highly silver filled, conductive adhesive designed to provide high (6-7 W/m°K) thermal conductivity and excellent electrical conductivity for attachment of integrated circuits and components to metallic lead frames. The materialism hydrophobic and stable at high temperatures.
These features produce void-free bond lines with excellent adhesive strength to a wide variety of metals and ceramic surfaces, including copper, silver-plated copper, preplaced lead frames(Nordau) and Alloy 42. A package or device manufactured with QMI 529HT will have high resistance to delaminating andpopcorning after multiple exposures to lead-free solder reflow temperatures.
The QMI 529HT is designed to achieve UPHsseveral orders of magnitude higher than conventional oven cured adhesives. Maximum productivity is realized through inline cure, either on the die bonder using a post die bond heater or on the wire bonder preheated.“This product and its use may be covered by patent 5,717,034 and bygone or more pending patent applications.”TYPICAL APPLICATIONS This product was developed as soft-solder replacement or for applications that require higher thermal or high electricalconductivityCURE SCHEDULEQMI 529HT can be cured using a variety of times and temperatures, depending on the specific cure equipment.
please contact your nearest 樂泰 Electronic Materials representative.
QMI 529HT是一種高度銀填充，導(dǎo)電粘合，可提供高（6-7 W / m°K）導(dǎo)熱性和出色的導(dǎo)電性，用于將集成電路和組件連接到金屬引線框。
材料在高溫下疏水且穩(wěn)定。這些特征產(chǎn)生對(duì)多種金屬和陶瓷表面具有優(yōu)異的 |
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