樂(lè)泰 ABLESTIK 8387A樂(lè)泰膠水,貼片膠
樂(lè)泰 ABLESTIK 8387A樂(lè)泰膠水,貼片膠樂(lè)泰 ABLESTIK 8387A樂(lè)泰膠水,貼片膠樂(lè)泰 ABLESTIK 8387A樂(lè)泰膠水,貼片膠樂(lè)泰 ABLESTIK 8387A樂(lè)泰膠水,貼片膠樂(lè)泰 ABLESTIK 8387A樂(lè)泰膠水,貼片膠樂(lè)泰 ABLESTIK 8387A樂(lè)泰膠水,貼片膠樂(lè)泰 ABLESTIK 8387A樂(lè)泰膠水,貼片膠樂(lè)泰 ABLESTIK 8387A樂(lè)泰膠水,貼片膠樂(lè)泰 ABLESTIK 8387A樂(lè)泰膠水,貼片膠樂(lè)泰 ABLESTIK 8387A樂(lè)泰膠水,貼片膠樂(lè)泰 ABLESTIK 8387A樂(lè)泰膠水,貼片膠樂(lè)泰 ABLESTIK 8387A樂(lè)泰膠水,貼片膠樂(lè)泰 ABLESTIK 8387A樂(lè)泰膠水,貼片膠
技術(shù)服務(wù)熱線:021-51693135 / 021-22818476
樂(lè)泰 ABLESTIK 8387A貼片膠適用于高通量智能卡貼合應(yīng)用。
典型的固化性能
治療Schedule2分鐘@ 150°C
替代治療時(shí)間表125分鐘125°C
Cure10 x 10 mm Si的重量損失在玻璃載玻片上死亡,%1
存儲(chǔ)
將產(chǎn)品存放在未開(kāi)封的容器中,干燥處。存儲(chǔ)信息可能在產(chǎn)品容器標(biāo)簽上顯示。*佳存儲(chǔ):-40至-20°C從容器中取出的物質(zhì)在使用過(guò)程中可能會(huì)受到污染。 不要將產(chǎn)品返回原來(lái)的容器。
樂(lè)泰 ABLESTIK 8387A die attach adhesive is designed for high throughput smart card bonding applications.
TYPICAL CURING PERFORMANCE
Cure Schedule2 minutes @ 150°C
Alternate Cure Schedule15minutes @ 125°C
Weight Loss on Cure10 x 10 mm Si die on glass slide, % 1
Storage
Store product in the unopened container in a dry location.Storage information may be indicated on the product container labeling.Optimal Storage : -40 to -20 °C Material removed from containers may be contaminated during use. Do not return product to the original container |
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