樂泰 ABLESTIK 8200TI樂泰膠水,導(dǎo)電膠
樂泰 ABLESTIK 8200TI樂泰膠水,導(dǎo)電膠樂泰 ABLESTIK 8200TI樂泰膠水,導(dǎo)電膠樂泰 ABLESTIK 8200TI樂泰膠水,導(dǎo)電膠樂泰 ABLESTIK 8200TI樂泰膠水,導(dǎo)電膠樂泰 ABLESTIK 8200TI樂泰膠水,導(dǎo)電膠樂泰 ABLESTIK 8200TI樂泰膠水,導(dǎo)電膠樂泰 ABLESTIK 8200TI樂泰膠水,導(dǎo)電膠樂泰 ABLESTIK 8200TI樂泰膠水,導(dǎo)電膠
技術(shù)服務(wù)熱線:021-51693135 / 021-22818476
樂泰 ABLESTIK 8200TI導(dǎo)電貼片粘合劑專為高可靠性封裝應(yīng)用而設(shè)計(jì),具有中等熱和電氣要求。 該材料在QFN型封裝上提供了改進(jìn)的JEDEC性能。
典型的固化性能
治療時(shí)間表在175°C時(shí),可達(dá)到175°C + 15分鐘
存儲(chǔ)
將產(chǎn)品存放在未開封的容器中,干燥處。 存儲(chǔ)信息可能在產(chǎn)品容器標(biāo)簽上顯示。*佳存儲(chǔ):-40°C。 儲(chǔ)存在低于( - )40°C或更高于 - ( - )40°C)可能會(huì)對產(chǎn)品性能產(chǎn)生不利影響。從容器中取出的材料在使用過程中可能會(huì)受到污染。不要將產(chǎn)品返回原始容器。
樂泰 ABLESTIK 8200TI electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and electrical requirements. This material offers improved JEDEC performance on QFN type packages.
TYPICAL CURING PERFORMANCE
Cure Schedule30 minute ramp to 175°C + 15 minutes @ 175°C
Storage
Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.Optimal Storage: -40 °C. Storage below minus (-)40 °C or greater than minus (-)40 °C can adversely affect product properties.Material removed from containers may be contaminated during use.Do not return product to the original container |
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