HYSOL FP4451電子組裝/HYSOL FP4451電子組裝/HYSOL FP4451電子組裝/HYSOL FP4451電子組裝/HYSOL FP4451電子組裝/HYSOL FP4451電子組裝/HYSOL FP4451電子組裝/HYSOL FP4451電子組裝/HYSOL FP4451電子組裝/HYSOL FP4451電子組裝/HYSOL FP4451電子組裝/HYSOL FP4451電子組裝/HYSOL FP4451電子組裝/HYSOL FP4451電子組裝/HYSOL FP4451電子組裝/HYSOL FP4451電子組裝/HYSOL FP4451電子組裝/HYSOL FP4451電子組裝/HYSOL FP4451電子組裝/HYSOL FP4451電子組裝/HYSOL FP4451電子組裝/HYSOL FP4451電子組裝/HYSOL FP4451電子組裝/HYSOL FP4451電子組裝/HYSOL FP4451電子組裝/HYSOL FP4451電子組裝/HYSOL FP4451電子組裝/HYSOL FP4451電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
技術服務熱線：021-51693135 / 021-22818476
FP4451 damming material is designed as a flow control barrier
around areas of bare chip encapsulation. FP4451 used in
combination with FP4450 passes pressure pot performance on
live devices up to 500 hours with no failures depending on
device and package type.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield - RVT, 25 °C, cps:
Spindle 7, speed 2 rpm 1,300,000
Spindle 7, speed 4 rpm 860,000
Specific Gravity @ 25 °C 1.76
Gel Time @ 121oC, minutes 8
Pot Life @ 25 °C(time to double viscosity), days 2
Shelf Life @ -40°C (from date of manufacture), months 9
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Recommended Cure Schedule
30 minutes @ 125°C plus
90 minutes @ 165°C
Alternative Cure Schedule
1 hour @ 165°C
This material can be co-cured after encapsulation.
The above cure profile is a guideline recommendation. Cure conditions
(time and temperature) may vary based on customers' experience and
their application requirements, as well as customer curing equipment,
oven loading and actual oven temperatures.
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: -40 °C. Storage below minus (-)40 °C or
greater than minus (-)40 °C can adversely affect product
properties
FP4451防水材料設計為流量控制屏障
周邊區(qū)域裸芯片封裝。 FP4451用于
與FP4450組 |
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