樂(lè)泰 3611電子組裝/樂(lè)泰 3611電子組裝/樂(lè)泰 3611電子組裝樂(lè)泰 3611電子組裝//工業(yè)膠水/電子組裝膠水/工業(yè)用膠
技術(shù)服務(wù)熱線(xiàn)：021-51693135 / 021-22818476
樂(lè)泰 3611 is designed for bonding of surface mounted
devices to printed circuit boards prior to wave soldering.
Particularly suited where very fast cure is required on high
speed SMT lines. The very low moisture absorption allows
longer exposure to humidity in open baths, without affecting
dispensability or causing void formation in the cured adhesive.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.3
Yield Point, 25 °C, Pa
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
125 to 400LMS
Casson Viscosity @ 25 °C, Pa∙s
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
20 to 50
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Recommended conditions for curing are exposure to heat
above 100 °C (typically 90-120 seconds @ 150 °C). Rate of
cure and final strength will depend on the residence time at the
cure temperature. Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or
greater than 8 °C can adversely affect product properties
樂(lè)泰 3611設(shè)計(jì)用于表面貼裝
設(shè)備到波峰焊前的印刷電路板。
特別適用于需要高速固化的地方
高速SMT線(xiàn)。非常低的吸濕性允許
更長(zhǎng)時(shí)間暴露于露天浴室的濕度，而不影響
可固化或在固化的粘合劑中形成空隙。
固化材料的典型特性
25°C比重1.3
屈服點(diǎn)，25°C，Pa
錐板流變儀：
Haake PK 100，M10 / PK 1 2°錐
125到400LMS
卡松粘度@ 25°C，Pa∙s
錐板流變儀：
Haake PK 100，M10 / PK 1 2°錐
20到50
閃點(diǎn) - 見(jiàn)SDS
典型的固化性能
固化的推薦條件是暴露于熱量
高于100℃（通常在150℃下為90-120秒）。比率
治愈和*終的力量將取決于在的停留時(shí)間
治愈溫度。
存儲(chǔ)
將產(chǎn)品存放在未開(kāi)封的容器中，干燥處。
存儲(chǔ)信息可能會(huì)在產(chǎn)品容器上顯示
標(biāo)簽。
*佳儲(chǔ)存：2°C至8°C。儲(chǔ)存溫度低于2°C或
大于8°C可能會(huì)對(duì)產(chǎn)品性能產(chǎn) |
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