ELECTRODAG 109電子組裝/ELECTRODAG 109電子組裝/ELECTRODAG 109電子組裝/ELECTRODAG 109電子組裝/ELECTRODAG 109電子組裝/ELECTRODAG 109電子組裝/ELECTRODAG 109電子組裝/ELECTRODAG 109電子組裝/ELECTRODAG 109電子組裝/ELECTRODAG 109電子組裝/ELECTRODAG 109電子組裝/ELECTRODAG 109電子組裝/ELECTRODAG 109電子組裝/ELECTRODAG 109電子組裝/ELECTRODAG 109電子組裝/ELECTRODAG 109電子組裝/ELECTRODAG 109電子組裝/ELECTRODAG 109電子組裝/ELECTRODAG 109電子組裝/ELECTRODAG 109電子組裝/ELECTRODAG 109電子組裝/ELECTRODAG 109電子組裝/ELECTRODAG 109電子組裝/ELECTRODAG 109電子組裝/ELECTRODAG 109電子組裝/ELECTRODAG 109電子組裝/ELECTRODAG 109電子組裝/ELECTRODAG 109電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
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樂泰 EDAG 109 E&C is designed for applications usingflexographic or rotogravure printing techniques. This product is fullymiscible with 樂泰 EDAG PM-457 silver ink to produce a wide
range of resistances.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Solids Content, % 40
Viscosity, Brookfield , mPa•s (cP):
Speed 20 rpm, @ 25oC 2,200
Density, kg/cm3 1,030
Theoretical coverage, m2/kg:
@ 10μm dry coating thickness 22
Shelf Life, from date of qualification in original seal, days 365
Flash Point , oC 14
TYPICAL DRYING CYCLE
Recommended Drying Cycle
15 to 30 minutes @ 70 to 80°C
樂泰 EDAG 109 E&C can be dried with forced air or infraredsystems. Higher temperatures for longer time will improve theperformance. However, care should be taken with infrared. Toomuch energy can destroy the coating. Design drying rates for themaximum the substrate and production speeds can tolerate.
The above cure profile is a guideline recommendation. Cureconditions (time and temperature) may vary based on customers'experience and their application requirements, as well as customeruring equipment, oven loading and actual oven temperatures. Storage Store product in the unopened container in a cool dry well ventilatearea. Storage information may be indicated on the product containerlabeling.Optimal Storage: 5 to 20°C. Storage below 5°C or greater than 20°C can adversely affect produc |
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